JPH0524552Y2 - - Google Patents
Info
- Publication number
- JPH0524552Y2 JPH0524552Y2 JP1985124363U JP12436385U JPH0524552Y2 JP H0524552 Y2 JPH0524552 Y2 JP H0524552Y2 JP 1985124363 U JP1985124363 U JP 1985124363U JP 12436385 U JP12436385 U JP 12436385U JP H0524552 Y2 JPH0524552 Y2 JP H0524552Y2
- Authority
- JP
- Japan
- Prior art keywords
- card
- metal frame
- lsi chip
- film
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985124363U JPH0524552Y2 (en]) | 1985-08-12 | 1985-08-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985124363U JPH0524552Y2 (en]) | 1985-08-12 | 1985-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6233477U JPS6233477U (en]) | 1987-02-27 |
JPH0524552Y2 true JPH0524552Y2 (en]) | 1993-06-22 |
Family
ID=31016305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985124363U Expired - Lifetime JPH0524552Y2 (en]) | 1985-08-12 | 1985-08-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0524552Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2558842B2 (ja) * | 1988-09-27 | 1996-11-27 | 松下電子工業株式会社 | Icカード |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607760A (ja) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Icカ−ドの製造方法 |
JPS60142488A (ja) * | 1983-12-28 | 1985-07-27 | Dainippon Printing Co Ltd | Icカ−ド |
-
1985
- 1985-08-12 JP JP1985124363U patent/JPH0524552Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6233477U (en]) | 1987-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5444301A (en) | Semiconductor package and method for manufacturing the same | |
US4800419A (en) | Support assembly for integrated circuits | |
US5999413A (en) | Resin sealing type semiconductor device | |
KR100705521B1 (ko) | 반도체 장치 | |
KR20010098590A (ko) | 반도체 장치 및 그 제조 방법 | |
US20030209815A1 (en) | Semiconductor device and its manufacturing method | |
JPH0524552Y2 (en]) | ||
JP2000148949A (ja) | 非接触icカードおよびその製造方法 | |
JP2000155820A (ja) | 非接触icカードおよびその製造方法 | |
JP2840166B2 (ja) | 半導体装置 | |
JP2000155821A (ja) | 非接触icカードおよびその製造方法 | |
JP3764213B2 (ja) | Icカード及びその製造方法 | |
JP3126782B2 (ja) | 薄型半導体装置の製造方法 | |
JP2568915B2 (ja) | Icカード | |
JP2904785B2 (ja) | カード内蔵用icモジユール | |
JPH01210394A (ja) | 集積回路装置 | |
JPS61125690A (ja) | Icカ−ド | |
JP3485736B2 (ja) | 半導体装置とその製造方法 | |
JP2513044Y2 (ja) | 半導体装置 | |
KR0147156B1 (ko) | 필름 온 칩 패키지와 그 제조방법 | |
JPH0450145Y2 (en]) | ||
JPH0815829B2 (ja) | Icカード用モジュールの製造方法 | |
JP2687775B2 (ja) | Tabテープ | |
JPS6194359U (en]) | ||
JPS62297194A (ja) | 電子部品を内蔵するカ−ド |